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Microsample tensile testing of nanocrystalline copper

Scripta Materialia

The tensile properties of nanocrystalline copper with grain sizes <100 nm produced by surface mechanical attrition treatment have been characterized using a microsample testing technique. The nanocrystalline copper exhibits a yield strength as high as 760 MPa, with a small elongation to failure. Factors leading to the high strength and low ductility are discussed. (C) 2003 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.

关键词: nanocrystalline materials;strength;ductility;fracture;copper;mechanical-behavior;metals;microstructure;ductility;strength;fatigue;alloy;cu

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